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FACTS & FIGURES

JCR Impact Factor: 1.102
JCR 5-Year IF: 0.734
Issues per year: 4
Current issue: Feb 2021
Next issue: May 2021
Avg review time: 56 days


PUBLISHER

Stefan cel Mare
University of Suceava
Faculty of Electrical Engineering and
Computer Science
13, Universitatii Street
Suceava - 720229
ROMANIA

Print ISSN: 1582-7445
Online ISSN: 1844-7600
WorldCat: 643243560
doi: 10.4316/AECE


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FEATURED ARTICLE

Improved Wind Speed Prediction Using Empirical Mode Decomposition, ZHANG, Y., ZHANG, C., SUN, J., GUO, J.
Issue 2/2018

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LATEST NEWS

2020-Jun-29
Clarivate Analytics published the InCites Journal Citations Report for 2019. The InCites JCR Impact Factor of Advances in Electrical and Computer Engineering is 1.102 (1.023 without Journal self-cites), and the InCites JCR 5-Year Impact Factor is 0.734.

2020-Jun-11
Starting on the 15th of June 2020 we wiil introduce a new policy for reviewers. Reviewers who provide timely and substantial comments will receive a discount voucher entitling them to an APC reduction. Vouchers (worth of 25 EUR or 50 EUR, depending on the review quality) will be assigned to reviewers after the final decision of the reviewed paper is given. Vouchers issued to specific individuals are not transferable.

2019-Dec-16
Starting on the 15th of December 2019 all paper authors are required to enter their SCOPUS IDs. You may use the free SCOPUS ID lookup form to find yours in case you don't remember it.

2019-Jun-20
Clarivate Analytics published the InCites Journal Citations Report for 2018. The JCR Impact Factor of Advances in Electrical and Computer Engineering is 0.650, and the JCR 5-Year Impact Factor is 0.639.

2018-May-31
Starting today, the minimum number a pages for a paper is 8, so all submitted papers should have 8, 10 or 12 pages. No exceptions will be accepted.

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  1/2010 - 4

 HIGHLY CITED PAPER 

Thermal Aspects Related to Power Assemblies

PLESCA, A. See more information about PLESCA, A. on SCOPUS See more information about PLESCA, A. on IEEExplore See more information about PLESCA, A. on Web of Science, SCINTEE, A. See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on Web of Science
 
Click to see author's profile in See more information about the author on SCOPUS SCOPUS, See more information about the author on IEEE Xplore IEEE Xplore, See more information about the author on Web of Science Web of Science

Download PDF pdficon (495 KB) | Citation | Downloads: 1,211 | Views: 4,678

Author keywords
heating, modeling, power assembly, simulation software, temperature

References keywords
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
Blue keywords are present in both the references section and the paper title.

About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568

Abstract
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Full text preview
In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions.


References | Cited By

Cited-By Clarivate Web of Science

Web of Science® Times Cited: 5 [View]
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Cited-By SCOPUS

SCOPUS® Times Cited: 5
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View citations in SCOPUS® [Free preview]

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Cited-By CrossRef

[1] Design Options for Thermal Shutdown Circuitry with Hysteresis Width Independent on the Activation Temperature, PLESA, C.-S., NEAG, M., RADOIAS, L., Advances in Electrical and Computer Engineering, ISSN 1582-7445, Issue 1, Volume 17, 2017.
Digital Object Identifier: 10.4316/AECE.2017.01010
[CrossRef] [Full text]

[2] Overheating of Underground Power Cable Line Due to Its Partial Exposition to Solar Radiation, Czapp, Stanislaw, Ratkowski, Filip, Szultka, Seweryn, Tomaszewski, Adam, 2019 24th International Conference on Methods and Models in Automation and Robotics (MMAR), ISBN 978-1-7281-0933-6, 2019.
Digital Object Identifier: 10.1109/MMAR.2019.8864691
[CrossRef]

[3] A solution for study of PID controllers using cRIO system, Rata, Gabriela, Rata, Mihai, 2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), ISBN 978-1-4799-7514-3, 2015.
Digital Object Identifier: 10.1109/ATEE.2015.7133685
[CrossRef]

Updated 1 week, 2 days ago

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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania


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