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Thermal Aspects Related to Power AssembliesPLESCA, A. , SCINTEE, A.
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heating, modeling, power assembly, simulation software, temperature
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
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About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568
In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions.
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 Design Options for Thermal Shutdown Circuitry with Hysteresis Width Independent on the Activation Temperature, PLESA, C.-S., NEAG, M., RADOIAS, L., Advances in Electrical and Computer Engineering, ISSN 1582-7445, Issue 1, Volume 17, 2017.
Digital Object Identifier: 10.4316/AECE.2017.01010 [CrossRef] [Full text]
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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
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