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Stefan cel Mare
University of Suceava
Faculty of Electrical Engineering and
Computer Science
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ROMANIA

Print ISSN: 1582-7445
Online ISSN: 1844-7600
WorldCat: 644266260
doi: 10.4316/AECE


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  2/2015 - 1
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Signal Integrity Applications of an EBG Surface

MATEKOVITS, L. See more information about MATEKOVITS, L. on SCOPUS See more information about MATEKOVITS, L. on IEEExplore See more information about MATEKOVITS, L. on Web of Science, DE SABATA, A. See more information about DE SABATA, A. on SCOPUS See more information about DE SABATA, A. on SCOPUS See more information about DE SABATA, A. on Web of Science
 
Click to see author's profile on See more information about the author on SCOPUS SCOPUS, See more information about the author on IEEE Xplore IEEE Xplore, See more information about the author on Web of Science Web of Science

Download PDF pdficon (1,048 KB) | Citation | Downloads: 499 | Views: 974

Author keywords
circuit noise, electromagnetic propagation, microwave integrated circuits

References keywords
electromagnetic(15), structures(9), microwave(9), bandgap(8), temc(7), power(7), electro(7), compat(7), sabata(6), parallel(6)
No common words between the references section and the paper title.

About this article
Date of Publication: 2015-05-31
Volume 15, Issue 2, Year 2015, On page(s): 3 - 8
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2015.02001
Web of Science Accession Number: 000356808900001
SCOPUS ID: 84979837478

Abstract
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Electromagnetic band-gap (EBG) surfaces have found applications in mitigation of parallel-plate noise that occurs in high speed circuits. A 2D periodic structure previously introduced by the same authors is dimensioned here for adjusting EBG parameters in view of meeting applications requirements by decreasing the phase velocity of the propagating waves. This adjustment corresponds to decreasing the lower bound of the EBG spectra. The positions of the EBGs' in frequency are determined through full-wave simulation, by solving the corresponding eigenmode equation and by imposing the appropriate boundary conditions on all faces of the unit cell. The operation of a device relying on a finite surface is also demonstrated. Obtained results show that the proposed structure fits for the signal integrity related applications as verified also by comparing the transmission along a finite structure of an ideal signal line and one with an induced discontinuity.


References | Cited By  «-- Click to see who has cited this paper

[1] R. Abhari, G.V. Eleftheriades, "Metallo-dielectric electromagnetic band-gap structures for suppression and isolation of the parallel-plate noise in high-speed circuits", IEEE Trans. Microwave Theory Tech., vol. 51, no. 6, pp. 1629-1639, June 2003.
[CrossRef] [Web of Science Times Cited 210] [SCOPUS Times Cited 262]


[2] S. Shahparnia, O.M. Ramahi, "Electromagnetic interference reduction from printed circuit boards using electromagnetic bandgap structures", IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-585, Nov. 2004.
[CrossRef] [Web of Science Times Cited 118] [SCOPUS Times Cited 149]


[3] T. Kamgaing, O.M. Ramahi, "Design and modeling of high-impedance surfaces for switching noise suppression in power planes," IEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479-489, Aug. 2005.
[CrossRef] [Web of Science Times Cited 50] [SCOPUS Times Cited 70]


[4] S.D. Rogers, "Electromagnetic bandgap layers for broad-band suppression of TEM modes in power planes", IEEE Trans. Microwave Theory Tech., vol. 53, no. 8, pp. 2495-2504, Aug. 2005.
[CrossRef] [Web of Science Times Cited 51] [SCOPUS Times Cited 71]


[5] B. Mohajer-Iravani, S. Shahparnia, "Coupling reduction in enclosures and cavities using electromagnetic bandgap structures", IEEE Trans. Electromagn. Compat., vol. 48, no. 2, pp. 292-303, May 2006.
[CrossRef] [Web of Science Times Cited 24] [SCOPUS Times Cited 36]


[6] A. Tavallee, and R. Abhari, "2-D characterization of electromagnetic bandgap structures employed in power distribution networks," IET Microwave. Antennas Propag., vol. 1, no. 1, pp. 204-211, 2007.
[CrossRef] [Web of Science Times Cited 15] [SCOPUS Times Cited 24]


[7] M.-S. Zhang, Y.-S. Li, C. Jia, L.-P. Li, "A power plane with wideband SSN suppression using a multi-via electromagnetic band-gap structure," IEEE Microwave Wireless Comp. Letters, vol. 17, no. 4, pp. 307-309, April, 2007.
[CrossRef] [Web of Science Times Cited 23] [SCOPUS Times Cited 32]


[8] J. Qin, O.M. Ramahi, V. Granatstein, "Novel planar electromagnetic bandgap structures for mitigation of switching noise and emi reduction in high-speed circuits", IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp. 661-669, Aug. 2007.
[CrossRef] [Web of Science Times Cited 11] [SCOPUS Times Cited 63]


[9] A. Ciccomancini Scogna, A. Orlandi, V. Ricchiuti, "Signal integrity analysis of single-ended and differential signaling in PCBs with EBG structures", IEEE International Symp on Electromagnetic Compatibility, EMC 2008, 18-22 Aug, pp. 1-6, 2008.
[CrossRef]


[10] T.-L. Wu, H.H. Chuang, T.-K. Wang, "Overview of power integrity solutions on package and PCB: decoupling and EBG isolation", IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 345-354, May 2010.
[CrossRef] [Web of Science Times Cited 82] [SCOPUS Times Cited 115]


[11] P.H. Rao, M. Swaminathan, "A novel compact electromagnetic bandgap structure in power plane for wideband noise suppression and low radiation", IEEE Trans. Electromagn. Compat., vol. 53, no. 4, pp. 905-1004, Nov. 2011.
[CrossRef] [Web of Science Times Cited 14] [SCOPUS Times Cited 14]


[12] S.L. Huh, M. Swaminathan, "A design technique for embedded electromagnetic bandgap structure in load board applications", IEEE Trans. Electromagn. Compat., vol. 54, no. 2, pp. 443-456, Apr. 2012.
[CrossRef] [Web of Science Times Cited 3] [SCOPUS Times Cited 3]


[13] A. De Sabata, L. Matekovits, "Electromagnetic bandgap solution for mitigation of parallel-plate noise in power distribution networks," Microwave and Optical Technology Lett., vol. 54, no.7, pp. 1689-1692, 2012.
[CrossRef] [Web of Science Times Cited 5] [SCOPUS Times Cited 8]


[14] D. Sievenpiper, L. Zhang, F. J. Boas, N. G. Alexˇpoulos, E. Yablonovitch, "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. MTT, vol. 47, no. 11, pp. 2059-2074, Nov. 1999.
[CrossRef] [Web of Science Times Cited 1708] [SCOPUS Times Cited 2273]


[15] L. Brillouin, Wave Propagation in Periodic Structures, New York, Dover, 1953.

[16] R.E. Collin, Foundations for Microwave Engineering, Second Edition, New York: Wiley-IEEE, (2001), Ch. 8.

[17] Computer Simulation Technology, Microwave Studio 2014.

[18] L. Matekovits, A. De Sabata, M. Orefice "'Parametric study of a unit cell with elliptical patch for periodic structures with variable number of grounding vias," Proc. of the Fourth European Conf. on Antennas and Propagation, EUCAP, Barcelona, April 12-16, pp. 1-3, 2007.

[19] A. De Sabata, L. Matekovits, "Design charts for grounded, elliptically shaped microstrip periodic structures featuring electromagnetic band-gap", 8th International Conference on Communications (COMM), Bucuresti, Romania, June 10-12, pp. 239-242, 2010. [
[CrossRef] [SCOPUS Times Cited 5]


[20] A. De Sabata, L. Matekovits, "Reduced complexity biasing solution for switched parallel-plate waveguide with embedded active metamaterial layer", Journal of Electromagnetic Waves and Applications (JEMWA), vol. 26, no. 14/15, pp. 1828-1836, 2012.
[CrossRef] [Web of Science Times Cited 5] [SCOPUS Times Cited 6]


[21] L. Matekovits, A. De Sabata, K. P. Esselle, "Effects of a coplanar waveguide biasing network built into the ground plane on the dispersion characteristics of a tunable unit cell with an elliptical patch and multiple vias", IEEE Antennas and Wireless Propagation Letters, vol. 10, pp. 1088-1091, 2011.
[CrossRef] [Web of Science Times Cited 7] [SCOPUS Times Cited 7]


[22] W. H. She, Z. N. Wing, J. W. Halloran, W. J. Chappell, "Variable dielectric constants by structured porosity for passive ceramic components," Digest of 2005 IEEE MTT-S International Microwave Symposium, pp. 865-869, 12-17 June 2005.
[CrossRef] [SCOPUS Times Cited 8]


[23] L. Matekovits, A. De Sabata, "Patterned Surface with Added Corrugations in View of Displacing EBGs to Lower Frequencies," IEEE International Symposium on Antennas and Propagation and USNC-URSI national Radio Science Meeting, Orlando, FL, pp. 81-82, July 7-13, 2013.
[CrossRef] [SCOPUS Times Cited 2]


[24] E. Rajo-Iglesias, A.U. Zaman, P.-S. Kildal, "Parallel-plate cavity mode suppression in microstrip circuit packages using lid of nails", IEEE Microw. Wireless Compon. Lett., vol. 20, no.1, pp. 31-33, Jan. 2010.
[CrossRef] [Web of Science Times Cited 30] [SCOPUS Times Cited 69]


[25] E. Rajo-Iglesias, E. Pucci, A. A. Kishk P.-S. Kildal "Suppression of parallel plate modes in low frequency microstrip circuit packages using lid of printed zigzag wires," IEEE Microwave Wireless Comp. Lett., vol. 23, no. 7, pp. 359-361, 2013.
[CrossRef] [Web of Science Times Cited 8] [SCOPUS Times Cited 8]


[26] P.-S. Kildal, E. Alfonso, A. Valero-Nogueira E. Rajo-Iglesias "Local metamaterial-based waveguides in gaps between parallel metal plates," IEEE Antennas Wireless Propag. Lett.,vol.8, pp. 84-87, 2009.
[CrossRef]




References Weight

Web of Science« Citations for all references: 2,364 TCR
SCOPUS« Citations for all references: 3,225 TCR

Web of Science« Average Citations per reference: 88 ACR
SCOPUS« Average Citations per reference: 119 ACR

TCR = Total Citations for References / ACR = Average Citations per Reference

We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more

Citations for references updated on 2016-12-09 10:27 in 119 seconds.




Note1: Web of Science« is a registered trademark of Thomson Reuters.
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Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site.

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