Click to open the HelpDesk interface
AECE - Front page banner

Menu:


FACTS & FIGURES

JCR Impact Factor: 0.699
JCR 5-Year IF: 0.674
Issues per year: 4
Current issue: Aug 2018
Next issue: Nov 2018
Avg review time: 82 days


PUBLISHER

Stefan cel Mare
University of Suceava
Faculty of Electrical Engineering and
Computer Science
13, Universitatii Street
Suceava - 720229
ROMANIA

Print ISSN: 1582-7445
Online ISSN: 1844-7600
WorldCat: 643243560
doi: 10.4316/AECE


TRAFFIC STATS

2,045,127 unique visits
545,295 downloads
Since November 1, 2009



No robots online now


SJR SCImago RANK

SCImago Journal & Country Rank


SEARCH ENGINES

aece.ro - Google Pagerank




TEXT LINKS

Anycast DNS Hosting
MOST RECENT ISSUES

 Volume 18 (2018)
 
     »   Issue 3 / 2018
 
     »   Issue 2 / 2018
 
     »   Issue 1 / 2018
 
 
 Volume 17 (2017)
 
     »   Issue 4 / 2017
 
     »   Issue 3 / 2017
 
     »   Issue 2 / 2017
 
     »   Issue 1 / 2017
 
 
 Volume 16 (2016)
 
     »   Issue 4 / 2016
 
     »   Issue 3 / 2016
 
     »   Issue 2 / 2016
 
     »   Issue 1 / 2016
 
 
 Volume 15 (2015)
 
     »   Issue 4 / 2015
 
     »   Issue 3 / 2015
 
     »   Issue 2 / 2015
 
     »   Issue 1 / 2015
 
 
  View all issues  








LATEST NEWS

2018-Jun-27
Clarivate Analytics published the InCites Journal Citations Report for 2017. The JCR Impact Factor of Advances in Electrical and Computer Engineering is 0.699, and the JCR 5-Year Impact Factor is 0.674.

2017-Jun-14
Thomson Reuters published the Journal Citations Report for 2016. The JCR Impact Factor of Advances in Electrical and Computer Engineering is 0.595, and the JCR 5-Year Impact Factor is 0.661.

2017-Feb-16
With new technologies, such as mobile communications, internet of things, and wide applications of social media, organizations generate a huge volume of data, much faster than several years ago. Big data, characterized by high volume, diversity and velocity, increasingly drives decision making and is changing the landscape of business intelligence, from governments to private organizations, from communities to individuals. Big data analytics that discover insights from evidences has a high demand for computing efficiency, knowledge discovery, problem solving, and event prediction. We dedicate a special section of Issue 4/2017 to Big Data. Prospective authors are asked to make the submissions for this section no later than the 31st of May 2017, placing "BigData - " before the paper title in OpenConf.

Read More »


    
 

  2/2015 - 1
View TOC | « Previous Article | Next Article »

Signal Integrity Applications of an EBG Surface

MATEKOVITS, L. See more information about MATEKOVITS, L. on SCOPUS See more information about MATEKOVITS, L. on IEEExplore See more information about MATEKOVITS, L. on Web of Science, DE SABATA, A. See more information about DE SABATA, A. on SCOPUS See more information about DE SABATA, A. on SCOPUS See more information about DE SABATA, A. on Web of Science
 
Click to see author's profile in See more information about the author on SCOPUS SCOPUS, See more information about the author on IEEE Xplore IEEE Xplore, See more information about the author on Web of Science Web of Science

Download PDF pdficon (1,048 KB) | Citation | Downloads: 599 | Views: 1,880

Author keywords
circuit noise, electromagnetic propagation, microwave integrated circuits

References keywords
electromagnetic(15), structures(9), microwave(9), bandgap(8), temc(7), power(7), electro(7), compat(7), sabata(6), parallel(6)
No common words between the references section and the paper title.

About this article
Date of Publication: 2015-05-31
Volume 15, Issue 2, Year 2015, On page(s): 3 - 8
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2015.02001
Web of Science Accession Number: 000356808900001
SCOPUS ID: 84979837478

Abstract
Quick view
Full text preview
Electromagnetic band-gap (EBG) surfaces have found applications in mitigation of parallel-plate noise that occurs in high speed circuits. A 2D periodic structure previously introduced by the same authors is dimensioned here for adjusting EBG parameters in view of meeting applications requirements by decreasing the phase velocity of the propagating waves. This adjustment corresponds to decreasing the lower bound of the EBG spectra. The positions of the EBGs' in frequency are determined through full-wave simulation, by solving the corresponding eigenmode equation and by imposing the appropriate boundary conditions on all faces of the unit cell. The operation of a device relying on a finite surface is also demonstrated. Obtained results show that the proposed structure fits for the signal integrity related applications as verified also by comparing the transmission along a finite structure of an ideal signal line and one with an induced discontinuity.


References | Cited By  «-- Click to see who has cited this paper

[1] R. Abhari, G.V. Eleftheriades, "Metallo-dielectric electromagnetic band-gap structures for suppression and isolation of the parallel-plate noise in high-speed circuits", IEEE Trans. Microwave Theory Tech., vol. 51, no. 6, pp. 1629-1639, June 2003.
[CrossRef] [Web of Science Times Cited 235] [SCOPUS Times Cited 287]


[2] S. Shahparnia, O.M. Ramahi, "Electromagnetic interference reduction from printed circuit boards using electromagnetic bandgap structures", IEEE Trans. Electromagn. Compat., vol. 46, no. 4, pp. 580-585, Nov. 2004.
[CrossRef] [Web of Science Times Cited 132] [SCOPUS Times Cited 166]


[3] T. Kamgaing, O.M. Ramahi, "Design and modeling of high-impedance surfaces for switching noise suppression in power planes," IEEE Trans. Electromagn. Compat., vol. 47, no. 3, pp. 479-489, Aug. 2005.
[CrossRef] [Web of Science Times Cited 61] [SCOPUS Times Cited 77]


[4] S.D. Rogers, "Electromagnetic bandgap layers for broad-band suppression of TEM modes in power planes", IEEE Trans. Microwave Theory Tech., vol. 53, no. 8, pp. 2495-2504, Aug. 2005.
[CrossRef] [Web of Science Times Cited 67] [SCOPUS Times Cited 81]


[5] B. Mohajer-Iravani, S. Shahparnia, "Coupling reduction in enclosures and cavities using electromagnetic bandgap structures", IEEE Trans. Electromagn. Compat., vol. 48, no. 2, pp. 292-303, May 2006.
[CrossRef] [Web of Science Times Cited 29] [SCOPUS Times Cited 41]


[6] A. Tavallee, and R. Abhari, "2-D characterization of electromagnetic bandgap structures employed in power distribution networks," IET Microwave. Antennas Propag., vol. 1, no. 1, pp. 204-211, 2007.
[CrossRef] [Web of Science Times Cited 20] [SCOPUS Times Cited 27]


[7] M.-S. Zhang, Y.-S. Li, C. Jia, L.-P. Li, "A power plane with wideband SSN suppression using a multi-via electromagnetic band-gap structure," IEEE Microwave Wireless Comp. Letters, vol. 17, no. 4, pp. 307-309, April, 2007.
[CrossRef] [Web of Science Times Cited 30] [SCOPUS Times Cited 39]


[8] J. Qin, O.M. Ramahi, V. Granatstein, "Novel planar electromagnetic bandgap structures for mitigation of switching noise and emi reduction in high-speed circuits", IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp. 661-669, Aug. 2007.
[CrossRef] [Web of Science Times Cited 21] [SCOPUS Times Cited 67]


[9] A. Ciccomancini Scogna, A. Orlandi, V. Ricchiuti, "Signal integrity analysis of single-ended and differential signaling in PCBs with EBG structures", IEEE International Symp on Electromagnetic Compatibility, EMC 2008, 18-22 Aug, pp. 1-6, 2008.
[CrossRef]


[10] T.-L. Wu, H.H. Chuang, T.-K. Wang, "Overview of power integrity solutions on package and PCB: decoupling and EBG isolation", IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 345-354, May 2010.
[CrossRef] [Web of Science Times Cited 111] [SCOPUS Times Cited 140]


[11] P.H. Rao, M. Swaminathan, "A novel compact electromagnetic bandgap structure in power plane for wideband noise suppression and low radiation", IEEE Trans. Electromagn. Compat., vol. 53, no. 4, pp. 905-1004, Nov. 2011.
[CrossRef] [Web of Science Times Cited 22] [SCOPUS Times Cited 27]


[12] S.L. Huh, M. Swaminathan, "A design technique for embedded electromagnetic bandgap structure in load board applications", IEEE Trans. Electromagn. Compat., vol. 54, no. 2, pp. 443-456, Apr. 2012.
[CrossRef] [Web of Science Times Cited 6] [SCOPUS Times Cited 6]


[13] A. De Sabata, L. Matekovits, "Electromagnetic bandgap solution for mitigation of parallel-plate noise in power distribution networks," Microwave and Optical Technology Lett., vol. 54, no.7, pp. 1689-1692, 2012.
[CrossRef] [Web of Science Times Cited 7] [SCOPUS Times Cited 9]


[14] D. Sievenpiper, L. Zhang, F. J. Boas, N. G. Alexópoulos, E. Yablonovitch, "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. MTT, vol. 47, no. 11, pp. 2059-2074, Nov. 1999.
[CrossRef] [Web of Science Times Cited 2083] [SCOPUS Times Cited 2684]


[15] L. Brillouin, Wave Propagation in Periodic Structures, New York, Dover, 1953.

[16] R.E. Collin, Foundations for Microwave Engineering, Second Edition, New York: Wiley-IEEE, (2001), Ch. 8.

[17] Computer Simulation Technology, Microwave Studio 2014.

[18] L. Matekovits, A. De Sabata, M. Orefice "'Parametric study of a unit cell with elliptical patch for periodic structures with variable number of grounding vias," Proc. of the Fourth European Conf. on Antennas and Propagation, EUCAP, Barcelona, April 12-16, pp. 1-3, 2007.

[19] A. De Sabata, L. Matekovits, "Design charts for grounded, elliptically shaped microstrip periodic structures featuring electromagnetic band-gap", 8th International Conference on Communications (COMM), Bucuresti, Romania, June 10-12, pp. 239-242, 2010. [
[CrossRef] [SCOPUS Times Cited 7]


[20] A. De Sabata, L. Matekovits, "Reduced complexity biasing solution for switched parallel-plate waveguide with embedded active metamaterial layer", Journal of Electromagnetic Waves and Applications (JEMWA), vol. 26, no. 14/15, pp. 1828-1836, 2012.
[CrossRef] [Web of Science Times Cited 7] [SCOPUS Times Cited 7]


[21] L. Matekovits, A. De Sabata, K. P. Esselle, "Effects of a coplanar waveguide biasing network built into the ground plane on the dispersion characteristics of a tunable unit cell with an elliptical patch and multiple vias", IEEE Antennas and Wireless Propagation Letters, vol. 10, pp. 1088-1091, 2011.
[CrossRef] [Web of Science Times Cited 7] [SCOPUS Times Cited 7]


[22] W. H. She, Z. N. Wing, J. W. Halloran, W. J. Chappell, "Variable dielectric constants by structured porosity for passive ceramic components," Digest of 2005 IEEE MTT-S International Microwave Symposium, pp. 865-869, 12-17 June 2005.
[CrossRef] [SCOPUS Times Cited 10]


[23] L. Matekovits, A. De Sabata, "Patterned Surface with Added Corrugations in View of Displacing EBGs to Lower Frequencies," IEEE International Symposium on Antennas and Propagation and USNC-URSI national Radio Science Meeting, Orlando, FL, pp. 81-82, July 7-13, 2013.
[CrossRef] [SCOPUS Times Cited 2]


[24] E. Rajo-Iglesias, A.U. Zaman, P.-S. Kildal, "Parallel-plate cavity mode suppression in microstrip circuit packages using lid of nails", IEEE Microw. Wireless Compon. Lett., vol. 20, no.1, pp. 31-33, Jan. 2010.
[CrossRef] [Web of Science Times Cited 59] [SCOPUS Times Cited 90]


[25] E. Rajo-Iglesias, E. Pucci, A. A. Kishk P.-S. Kildal "Suppression of parallel plate modes in low frequency microstrip circuit packages using lid of printed zigzag wires," IEEE Microwave Wireless Comp. Lett., vol. 23, no. 7, pp. 359-361, 2013.
[CrossRef] [Web of Science Times Cited 13] [SCOPUS Times Cited 14]


[26] P.-S. Kildal, E. Alfonso, A. Valero-Nogueira E. Rajo-Iglesias "Local metamaterial-based waveguides in gaps between parallel metal plates," IEEE Antennas Wireless Propag. Lett.,vol.8, pp. 84-87, 2009.
[CrossRef]




References Weight

Web of Science® Citations for all references: 2,910 TCR
SCOPUS® Citations for all references: 3,788 TCR

Web of Science® Average Citations per reference: 108 ACR
SCOPUS® Average Citations per reference: 140 ACR

TCR = Total Citations for References / ACR = Average Citations per Reference

We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more

Citations for references updated on 2018-09-17 20:37 in 177 seconds.




Note1: Web of Science® is a registered trademark of Clarivate Analytics.
Note2: SCOPUS® is a registered trademark of Elsevier B.V.
Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site.

Copyright ©2001-2018
Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania


All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.

Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.

Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.




Website loading speed and performance optimization powered by: