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JCR Impact Factor: 0.459
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Stefan cel Mare
University of Suceava
Faculty of Electrical Engineering and
Computer Science
13, Universitatii Street
Suceava - 720229
ROMANIA

Print ISSN: 1582-7445
Online ISSN: 1844-7600
WorldCat: 644266260
doi: 10.4316/AECE


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2016-Jun-14
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  1/2010 - 4

Thermal Aspects Related to Power Assemblies

PLESCA, A. See more information about PLESCA, A. on SCOPUS See more information about PLESCA, A. on IEEExplore See more information about PLESCA, A. on Web of Science, SCINTEE, A. See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on Web of Science
 
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Download PDF pdficon (495 KB) | Citation | Downloads: 1,121 | Views: 3,550

Author keywords
heating, modeling, power assembly, simulation software, temperature

References keywords
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
Blue keywords are present in both the references section and the paper title.

About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568

Abstract
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In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions.


References | Cited By  «-- Click to see who has cited this paper

[1] C. J. M. Lasance, "Electronics Cooling: The Need For A Change In Thermal Design Philosophy", Southborough, MA., 1995

[2] L. Mays and K. Kime, "Utilizing low forward voltage drop power semiconductors to minimize heat sinking requirements in multichip module DC solid state relays and static switching applications", in Proc. 1998 Multichip Modules and High Density Packaging Conf., pp. 149-154
[CrossRef]


[3] Q. Qian, Y. Liu, Y. Liu, H. Yang and S. Irving, "TO220 package lead frame optimization for reducing trim and form delamination by simulation", in Proc. 2005 Electronic Packaging Technology Conf., pp. 157-160
[CrossRef] [SCOPUS Record]


[4] G. Rata, M. Rata, I. Graur, and L. D. Milici, "Induction Motor Speed Estimator Using Rotor Slot Harmonics", Advances in Electrical and Computer Engineering, vol. 9, Issue 1, pp. 70-73
[CrossRef] [Full Text] [Web of Science Times Cited 10] [SCOPUS Times Cited 8]


[5] S. Narasimhan and J. Majdalani, "Characterization of compact heat sink models in natural convection", IEEE Trans. Components and Packaging Technologies, vol. 25, Issue 1, pp. 78-86, March 2002
[CrossRef] [Web of Science Times Cited 27] [SCOPUS Times Cited 37]


[6] S. P. Watson and B. G. Sammakia, "The thermal performance of a chip scale package array with simple block and plate heat sinks", in Proc. 2002 Thermal and Thermomechanical Phenomena in Electronic Systems Conf., pp. 276-284
[CrossRef] [Web of Science Record] [SCOPUS Record]


[7] L. T. Yeh, "Effect due to a series of heat sinks on component temperatures", in Proc. 1998 Thermal and Thermomechanical Phenomena in Electronic Systems Conf., pp. 118-123.
[CrossRef] [Web of Science Record]


[8] E. De Baetselier, W. Goedertier, and G. De Mey, "A survey of the thermal stability of an active heat sink", in Proc. 1996 Thermal Phenomena in Electronics Systems Conf., pp. 373-382
[CrossRef] [Web of Science Record]


[9] M. Rata, G. Rata, L. D. Milici, and I. Graur, "An Efficient Solution of the Step-down Converter for Students Teaching", Electronics and Electrical Engineering (Elektronika ir Elektrotechnika), no. 3(91), pp. 77-80, 2009

[10] A. Shah, B. G. Sammakia, H. Srihari, and K. Ramakrishna, "A numerical study of the thermal performance of an impingement heat sink-fin shape optimization", IEEE Trans. Components and Packaging Technologies, vol. 27, Issue 4, pp. 710-717, Dec. 2004
[CrossRef] [Web of Science Times Cited 27] [SCOPUS Times Cited 37]


[11] S. Narasimhan, A. Bar-Cohen and R. Nair, "Thermal compact modeling of parallel plate heat sinks", IEEE Trans. Components and Packaging Technologies, vol. 26, Issue 1, pp. 136-146, March 2003
[CrossRef] [Web of Science Times Cited 13] [SCOPUS Times Cited 18]


[12] J. R. Culham, M. M. Yovanovich, and S. Lee, "Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection", IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 18, Issue 3, pp. 559-566, Sept. 1995
[CrossRef] [Web of Science Times Cited 28] [SCOPUS Times Cited 43]


[13] M. Rata, G. Rata, C. E. Bobric, "Three-phase PVM inverter with HEF4752", Advances in Electrical and Computer Engineering, vol. 3, Issue 1, pp. 90-93, 2003

[14] T. S. Fisher, K. E. Torrance, and K. K. Sikka, "Analysis and optimization of a natural draft heat sink system" in Proc. 1996 Thermal Phenomena in Electronics Systems Conf., pp. 115-123
[CrossRef] [Web of Science Record]


[15] A. T. Morrison, "Optimization of heat sink fin geometries for heat sinks in natural convection", in Proc. 1992 Thermal Phenomena in Electronics Systems Conf., pp. 145-148
[CrossRef]


[16] J. R. Culham and Y. S. Muzychka, "Optimization of plate fin heat sinks using entropy generation minimization", IEEE Trans. Components and Packaging Technologies, vol. 24, Issue 2, pp. 159-165, June 2001
[CrossRef] [Web of Science Times Cited 109] [SCOPUS Times Cited 145]


References Weight

Web of Science® Citations for all references: 214 TCR
SCOPUS® Citations for all references: 288 TCR

Web of Science® Average Citations per reference: 13 ACR
SCOPUS® Average Citations per reference: 18 ACR

TCR = Total Citations for References / ACR = Average Citations per Reference

We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more

Citations for references updated on 2016-12-04 08:53 in 72 seconds.




Note1: Web of Science® is a registered trademark of Thomson Reuters.
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Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site.

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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania


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