| 1/2010 - 4 |
Thermal Aspects Related to Power AssembliesPLESCA, A.   , SCINTEE, A. |
View the paper record and citations in  |
| Click to see author's profile in SCOPUS, IEEE Xplore, Web of Science |
Download PDF  (495 KB) | Citation | Downloads: 1,623 | Views: 5,635 |
Author keywords
heating, modeling, power assembly, simulation software, temperature
References keywords
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
Blue keywords are present in both the references section and the paper title.
About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568
Abstract
In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions. |
| References | | | Cited By «-- Click to see who has cited this paper |
| [1] C. J. M. Lasance, "Electronics Cooling: The Need For A Change In Thermal Design Philosophy", Southborough, MA., 1995
[2] L. Mays and K. Kime, "Utilizing low forward voltage drop power semiconductors to minimize heat sinking requirements in multichip module DC solid state relays and static switching applications", in Proc. 1998 Multichip Modules and High Density Packaging Conf., pp. 149-154 [CrossRef] [SCOPUS Times Cited 3] [3] Q. Qian, Y. Liu, Y. Liu, H. Yang and S. Irving, "TO220 package lead frame optimization for reducing trim and form delamination by simulation", in Proc. 2005 Electronic Packaging Technology Conf., pp. 157-160 [CrossRef] [SCOPUS Times Cited 2] [4] G. Rata, M. Rata, I. Graur, and L. D. Milici, "Induction Motor Speed Estimator Using Rotor Slot Harmonics", Advances in Electrical and Computer Engineering, vol. 9, Issue 1, pp. 70-73 [CrossRef] [Full Text] [Web of Science Times Cited 17] [SCOPUS Times Cited 19] [5] S. Narasimhan and J. Majdalani, "Characterization of compact heat sink models in natural convection", IEEE Trans. Components and Packaging Technologies, vol. 25, Issue 1, pp. 78-86, March 2002 [CrossRef] [Web of Science Times Cited 40] [SCOPUS Times Cited 53] [6] S. P. Watson and B. G. Sammakia, "The thermal performance of a chip scale package array with simple block and plate heat sinks", in Proc. 2002 Thermal and Thermomechanical Phenomena in Electronic Systems Conf., pp. 276-284 [CrossRef] [Web of Science Record] [SCOPUS Record] [7] L. T. Yeh, "Effect due to a series of heat sinks on component temperatures", in Proc. 1998 Thermal and Thermomechanical Phenomena in Electronic Systems Conf., pp. 118-123. [CrossRef] [Web of Science Record] [8] E. De Baetselier, W. Goedertier, and G. De Mey, "A survey of the thermal stability of an active heat sink", in Proc. 1996 Thermal Phenomena in Electronics Systems Conf., pp. 373-382 [CrossRef] [Web of Science Times Cited 1] [9] M. Rata, G. Rata, L. D. Milici, and I. Graur, "An Efficient Solution of the Step-down Converter for Students Teaching", Electronics and Electrical Engineering (Elektronika ir Elektrotechnika), no. 3(91), pp. 77-80, 2009 [10] A. Shah, B. G. Sammakia, H. Srihari, and K. Ramakrishna, "A numerical study of the thermal performance of an impingement heat sink-fin shape optimization", IEEE Trans. Components and Packaging Technologies, vol. 27, Issue 4, pp. 710-717, Dec. 2004 [CrossRef] [Web of Science Times Cited 40] [SCOPUS Times Cited 53] [11] S. Narasimhan, A. Bar-Cohen and R. Nair, "Thermal compact modeling of parallel plate heat sinks", IEEE Trans. Components and Packaging Technologies, vol. 26, Issue 1, pp. 136-146, March 2003 [CrossRef] [Web of Science Times Cited 13] [SCOPUS Times Cited 18] [12] J. R. Culham, M. M. Yovanovich, and S. Lee, "Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection", IEEE Trans. Components, Packaging, and Manufacturing Technology, vol. 18, Issue 3, pp. 559-566, Sept. 1995 [CrossRef] [Web of Science Times Cited 37] [SCOPUS Times Cited 55] [13] M. Rata, G. Rata, C. E. Bobric, "Three-phase PVM inverter with HEF4752", Advances in Electrical and Computer Engineering, vol. 3, Issue 1, pp. 90-93, 2003 [14] T. S. Fisher, K. E. Torrance, and K. K. Sikka, "Analysis and optimization of a natural draft heat sink system" in Proc. 1996 Thermal Phenomena in Electronics Systems Conf., pp. 115-123 [CrossRef] [Web of Science Record] [15] A. T. Morrison, "Optimization of heat sink fin geometries for heat sinks in natural convection", in Proc. 1992 Thermal Phenomena in Electronics Systems Conf., pp. 145-148 [CrossRef] [16] J. R. Culham and Y. S. Muzychka, "Optimization of plate fin heat sinks using entropy generation minimization", IEEE Trans. Components and Packaging Technologies, vol. 24, Issue 2, pp. 159-165, June 2001 [CrossRef] [Web of Science Times Cited 177] [SCOPUS Times Cited 215] Web of Science® Citations for all references: 325 TCR SCOPUS® Citations for all references: 418 TCR Web of Science® Average Citations per reference: 20 ACR SCOPUS® Average Citations per reference: 26 ACR TCR = Total Citations for References / ACR = Average Citations per Reference We introduced in 2010 - for the first time in scientific publishing, the term "References Weight", as a quantitative indication of the quality ... Read more Citations for references updated on 2024-04-19 23:55 in 78 seconds. Note1: Web of Science® is a registered trademark of Clarivate Analytics. Note2: SCOPUS® is a registered trademark of Elsevier B.V. Disclaimer: All queries to the respective databases were made by using the DOI record of every reference (where available). Due to technical problems beyond our control, the information is not always accurate. Please use the CrossRef link to visit the respective publisher site. |
Copyright ©2001-2024
Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.
Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
All rights reserved: Advances in Electrical and Computer Engineering is a registered trademark of the Stefan cel Mare University of Suceava. No part of this publication may be reproduced, stored in a retrieval system, photocopied, recorded or archived, without the written permission from the Editor. When authors submit their papers for publication, they agree that the copyright for their article be transferred to the Faculty of Electrical Engineering and Computer Science, Stefan cel Mare University of Suceava, Romania, if and only if the articles are accepted for publication. The copyright covers the exclusive rights to reproduce and distribute the article, including reprints and translations.
Permission for other use: The copyright owner's consent does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific written permission must be obtained from the Editor for such copying. Direct linking to files hosted on this website is strictly prohibited.
Disclaimer: Whilst every effort is made by the publishers and editorial board to see that no inaccurate or misleading data, opinions or statements appear in this journal, they wish to make it clear that all information and opinions formulated in the articles, as well as linguistic accuracy, are the sole responsibility of the author.
