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JCR Impact Factor: 0.800
JCR 5-Year IF: 1.000
SCOPUS CiteScore: 2.0
Issues per year: 4
Current issue: Feb 2024
Next issue: May 2024
Avg review time: 78 days
Avg accept to publ: 48 days
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PUBLISHER

Stefan cel Mare
University of Suceava
Faculty of Electrical Engineering and
Computer Science
13, Universitatii Street
Suceava - 720229
ROMANIA

Print ISSN: 1582-7445
Online ISSN: 1844-7600
WorldCat: 643243560
doi: 10.4316/AECE


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FEATURED ARTICLE

Analysis of the Hybrid PSO-InC MPPT for Different Partial Shading Conditions, LEOPOLDINO, A. L. M., FREITAS, C. M., MONTEIRO, L. F. C.
Issue 2/2022

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2023-Jun-28
Clarivate Analytics published the InCites Journal Citations Report for 2022. The InCites JCR Impact Factor of Advances in Electrical and Computer Engineering is 0.800 (0.700 without Journal self-cites), and the InCites JCR 5-Year Impact Factor is 1.000.

2023-Jun-05
SCOPUS published the CiteScore for 2022, computed by using an improved methodology, counting the citations received in 2019-2022 and dividing the sum by the number of papers published in the same time frame. The CiteScore of Advances in Electrical and Computer Engineering for 2022 is 2.0. For "General Computer Science" we rank #134/233 and for "Electrical and Electronic Engineering" we rank #478/738.

2022-Jun-28
Clarivate Analytics published the InCites Journal Citations Report for 2021. The InCites JCR Impact Factor of Advances in Electrical and Computer Engineering is 0.825 (0.722 without Journal self-cites), and the InCites JCR 5-Year Impact Factor is 0.752.

2022-Jun-16
SCOPUS published the CiteScore for 2021, computed by using an improved methodology, counting the citations received in 2018-2021 and dividing the sum by the number of papers published in the same time frame. The CiteScore of Advances in Electrical and Computer Engineering for 2021 is 2.5, the same as for 2020 but better than all our previous results.

2021-Jun-30
Clarivate Analytics published the InCites Journal Citations Report for 2020. The InCites JCR Impact Factor of Advances in Electrical and Computer Engineering is 1.221 (1.053 without Journal self-cites), and the InCites JCR 5-Year Impact Factor is 0.961.

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  1/2010 - 4

 HIGHLY CITED PAPER 

Thermal Aspects Related to Power Assemblies

PLESCA, A. See more information about PLESCA, A. on SCOPUS See more information about PLESCA, A. on IEEExplore See more information about PLESCA, A. on Web of Science, SCINTEE, A. See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on SCOPUS See more information about SCINTEE, A. on Web of Science
 
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Download PDF pdficon (495 KB) | Citation | Downloads: 1,617 | Views: 5,611

Author keywords
heating, modeling, power assembly, simulation software, temperature

References keywords
heat(12), thermal(11), packaging(7), sinks(6), rata(6), systems(5), sink(5), phenomena(5), optimization(5), itherm(5)
Blue keywords are present in both the references section and the paper title.

About this article
Date of Publication: 2010-02-27
Volume 10, Issue 1, Year 2010, On page(s): 23 - 27
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: 10.4316/AECE.2010.01004
Web of Science Accession Number: 000275458900004
SCOPUS ID: 77954676568

Abstract
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In many cases when a power assembly based on power semiconductors is used, catastrophic failure is the result of steep temperature gradient in the localized temperature distribution. Hence, an optimal heatsink design for certain industrial applications has become a real necessity. In this paper, the Pro/ENGINEER software with the thermal simulation integrated tool, Pro/MECHANICA, has been used for thermal study of a specific power semiconductor assembly. A series of steady-state and transient thermal simulations have been performed. The experimental tests have confirmed the simulation results. Therefore, the use of specific 3D modeling and simulation software allows to design special power semiconductor assemblies with a better thermal transfer between its heatsink and power electronic components at given operating conditions.


References | Cited By

Cited-By Clarivate Web of Science

Web of Science® Times Cited: 6 [View]
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Cited-By SCOPUS

SCOPUS® Times Cited: 6
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Cited-By CrossRef

[1] Design Options for Thermal Shutdown Circuitry with Hysteresis Width Independent on the Activation Temperature, PLESA, C.-S., NEAG, M., RADOIAS, L., Advances in Electrical and Computer Engineering, ISSN 1582-7445, Issue 1, Volume 17, 2017.
Digital Object Identifier: 10.4316/AECE.2017.01010
[CrossRef] [Full text]

[2] Evaluation of Fire Hazard in Electrical Installations Due to Unfavorable Ambient Thermal Conditions, Szultka, Seweryn, Czapp, Stanislaw, Tomaszewski, Adam, Ullah, Hayat, Fire, ISSN 2571-6255, Issue 2, Volume 6, 2023.
Digital Object Identifier: 10.3390/fire6020041
[CrossRef]

[3] Overheating of Underground Power Cable Line Due to Its Partial Exposition to Solar Radiation, Czapp, Stanislaw, Ratkowski, Filip, Szultka, Seweryn, Tomaszewski, Adam, 2019 24th International Conference on Methods and Models in Automation and Robotics (MMAR), ISBN 978-1-7281-0933-6, 2019.
Digital Object Identifier: 10.1109/MMAR.2019.8864691
[CrossRef]

[4] A solution for study of PID controllers using cRIO system, Rata, Gabriela, Rata, Mihai, 2015 9th International Symposium on Advanced Topics in Electrical Engineering (ATEE), ISBN 978-1-4799-7514-3, 2015.
Digital Object Identifier: 10.1109/ATEE.2015.7133685
[CrossRef]

Updated 4 days, 18 hours ago

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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania


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