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Processing and Reliability of Square Coils Based on LTCCAlena PIETRIKOVA, Juraj BANSKY, Magdalena BUJALOBOKOVA
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coil, LTCC, photo-image inks, Fodel technology, reliability tests
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About this article
Date of Publication: 2005-04-02
Volume 5, Issue 2, Year 2005, On page(s): 5 - 9
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: Not assigned
Paper deals with quality and reliability of square coils processed by photo-imaging technique on LTCC. LTCC technology offers the construction of square coils suitable for RF and microwave advanced applications with better properties. Examples of a new line structuring method are photo-imaging inks applied on LTCC and in this paper are discussed critical process steps of Fodel technology from Du Pont. We designed and manufactured many planar and 3D square coils with narrow widths and spaces that offer the possibility to construct the coils under controlled inductance. We tested the quality and reliability of square coils by these tests: damp heat cyclic tests, thermal shocks, accelerated ageing thermal stress. Correlation among electrical properties, ageing and process condition of square coils based on Fodel technologies were analysed. The results have shown the positive effect of using smaller and more precise lines based on Fodel.
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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
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