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Flip-Chip Technology - A Step Beyond in Semiconductor IndustryValentin POPA
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flip chip, bonding, technology, packaging, SMT, SMD
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About this article
Date of Publication: 2004-04-02
Volume 4, Issue 1, Year 2004, On page(s): 24 - 30
ISSN: 1582-7445, e-ISSN: 1844-7600
Digital Object Identifier: Not assigned
Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. In contrast, wire bonding, the older technology, which flip chip is replacing uses face-up chips with a wire connection to each pad. The main advantages obtained by introducing this advanced technology consists in size reduction, high performance, high operating frequencies and data rates, flexibility, reliability and low cost over other packaging methods. Few considerations from production, assembling and surface mounted technology are presented in the final part of this paper.
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Faculty of Electrical Engineering and Computer Science
Stefan cel Mare University of Suceava, Romania
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